DUBLIN–(BUSINESS WIRE)–The “Global Semiconductor Assembly and Packaging Services Market 2020-2024” report has been added to ResearchAndMarkets.com’s offering.
The semiconductor assembly and packaging services market is poised to grow by $11.33 billion during 2020-2024, progressing at a CAGR of 3% during the forecast period.
This report on the semiconductor assembly and packaging services market provides a holistic analysis, market size and forecast, trends, growth drivers, and challenges, as well as vendor analysis covering around 25 vendors. The report offers an up-to-date analysis regarding the current global market scenario, latest trends and drivers, and the overall market environment.
The market is driven by the growing demand for semiconductor wafers, large-scale use of polymer adhesive technology, and development of 3D chip packaging, FIWLP, and FOWLP technology.
The semiconductor assembly and packaging services market analysis includes type segment, application segment, service provider segment, and geographical landscapes. This study identifies the development of 3D chip packaging, FIWLP, and FOWLP technology as one of the prime reasons driving the semiconductor assembly and packaging services market growth during the next few years.
The analyst presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters.
Companies Mentioned
- Amkor Technology Inc.
- ASE Technology Holding Co. Ltd.
- ChipMOS TECHNOLOGIES Inc.
- HANA Micron Inc.
- Intel Corp.
- King Yuan Electronic Corp. Ltd.
- Samsung Electro-Mechanics Co. Ltd.
- Siliconware Precision Industries Co. Ltd.
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Tongfu Microelectronics Co. Ltd.
This report on the semiconductor assembly and packaging services market covers the following areas:
- Semiconductor assembly and packaging services market sizing
- Semiconductor assembly and packaging services market forecast
- Semiconductor assembly and packaging services market industry analysis
The study was conducted using an objective combination of primary and secondary information including inputs from key participants in the industry. The report contains a comprehensive market and vendor landscape in addition to an analysis of the key vendors.
The analyst presents a detailed picture of the market by the way of study, synthesis, and summation of data from multiple sources by an analysis of key parameters such as profit, pricing, competition, and promotions. It presents various market facets by identifying the key industry influencers. The data presented is comprehensive, reliable, and a result of extensive research – both primary and secondary.
The market research report provides a complete competitive landscape and an in-depth vendor selection methodology and analysis using qualitative and quantitative research to forecast an accurate market growth.
Key Topics Covered:
1. Executive Summary
2. Market Landscape
- Market ecosystem
- Value chain analysis
3. Market Sizing
- Market definition
- Market segment analysis
- Market size 2019
- Market outlook: Forecast for 2019-2024
4. Five Forces Analysis
- Five forces analysis
- Bargaining power of buyers
- Bargaining power of suppliers
- Threat of new entrants
- Threat of substitutes
- Threat of rivalry
- Market condition
5. Market Segmentation by Application
- Market segments
- Comparison by Application
- Communication sector – Market size and forecast 2019-2024
- Industrial and automotive sector – Market size and forecast 2019-2024
- Computing and networking sector – Market size and forecast 2019-2024
- Consumer electronics sector – Market size and forecast 2019-2024
- Market opportunity by Application
6. Market Segmentation by Type
- Market segments
- Comparison by Type
- WLP – Market size and forecast 2019-2024
- Die level packaging – Market size and forecast 2019-2024
- Market opportunity by Type
7. By Service provider
8. Customer Landscape
9. Geographic Landscape
- Geographic segmentation
- Geographic comparison
- APAC – Market size and forecast 2019-2024
- North America – Market size and forecast 2019-2024
- Europe – Market size and forecast 2019-2024
- South America – Market size and forecast 2019-2024
- MEA – Market size and forecast 2019-2024
- Key leading countries
- Market opportunity by geography
- Market drivers
- Market challenges
- Market trends
10. Vendor Landscape
- Vendor landscape
- Landscape disruption
11. Vendor Analysis
- Vendors covered
- Market positioning of vendors
- Amkor Technology Inc.
- ASE Technology Holding Co. Ltd.
- ChipMOS TECHNOLOGIES Inc.
- HANA Micron Inc.
- Intel Corp.
- King Yuan Electronic Corp. Ltd.
- Samsung Electro-Mechanics Co. Ltd.
- Siliconware Precision Industries Co. Ltd.
- Taiwan Semiconductor Manufacturing Co. Ltd.
- Tongfu Microelectronics Co. Ltd.
12. Appendix
- Scope of the report
- Currency conversion rates for US$
- Research methodology
- List of abbreviations
For more information about this report visit https://www.researchandmarkets.com/r/45ddwe
